When it comes to microassembly, the fields of microtechnology, microelectronics and photonics have to face similar challenges.

For example, integrated photonics is a rapidly emerging field with applications such as optical fiber communication, automotive, quantum communications, etc. However, integrated photonics requires highly precise assembly processes to connect the waveguides with the optical components (such as lasers, filters, modulators, photodetectors, etc.).

Also, in microtechnology/microelectronics, novel trends such as e.g., in Photonics (LED, Lasers, Detectors, Sensors, and Imaging devices), or for Optical Communication Systems and Components (fiber related) or Quantum Medical Endoscopes require better precision, smaller integration and a speed less than 1 sec per move.

In this joint workshop, organized by the two Innovation Boosters Microtech and Photonics, Ciposa SA and FEMTOprint SA, we would like to bring together experts from different fields to jointly identify needs and possible new approaches in the field of microassembly.

This workshop aims for both, partners seeking an innovative solution and potential technology providers. Participants will also benefit from insights on current technology topics. This will be followed by group discussions where questions will be explored in more depth and potential areas of need and solutions will be discussed.

Furthermore, you will have the opportunity to network with potential project partners and, ideally, start a collaboration project that can be funded by the Innovation Boosters Microtech and Photonics.

To get the most out of this workshop, describe your need/challenge/problem in the field of microassembly already when you register!

Date: Thursday, 16th of March, 10:30 – 17:30
Place: Ciposa S.A. Rouges-Terres 61 2068 Hauterive